Reproduce the temperature profile of Reflow oven. Can observe the melting state of solder paste.
Easily achieved by the temperature profile of lead-free solder mounting.
- ● The top surface of the original heater control matrix, the optimal temperature distribution in the heating test
can also be unbalanced heat capacity with respect to the substrate.
- ● For each stage as well as temperature, time can be arbitrarily set, you can freely extend the time of peak reflow
- ● The observation windows on three sides and top of the front and back of the device, can be observed
in the furnace during operation Mokushi the state.
The VDM-3 video observation system can be used to store temperature and images./p>
Topside camera observation
|Applicable Circuit Board||Up to 70W x 70L x 10H mm|
|Outer Dimension||Main Unit : 320W x 285D x 310Hmm
Controller unit : 290W x 235D x 270Hmm
|Heating Method||Upper-face : Hot air
Lower-face : Extreme infrared radiation
|Cooling Method||Flowing air or N2 air (with flow adjustable valve)|
|ower Supply||200V 50/60Hz 3kVA 3Phase|
|Air||0.3 - 0.5MPa 100 liter/min (Maximum)|
|O2 Concentration in Furnace
(when using N2)
|100ppm minimum (Heating furnace is sealed up)|
|PCB Installation||Flat plate system|
|Upper-Heater||hot air heater : Approx. 2.8kW (Approx. 350W x 8 series)
* Deviation to standard nozzle can be set.
|Lower-Heater||Extreme infrared radiation heater : Approx. 360W|
|Temp. Accuracy||5C maximum (Maximum range : 50(W) x 50(L)mm in the center)|
|Measuring Temp. Range||Room temp. - 330C|
|N2 Gas Supply Function||25 liter/min. with flow regulating valve during operation.|
|Control||Exclusive softwarefor Windows XP|
|Weight||Main unit : Approx. 12kg Controller unit : Approx. 8kg|
- * The above specifications are subject to change without notice.