COMPACT REFLOW OVEN
High heating performance in spite of its small size allows for prototyping, heating test, evaluation and production.
It is a best-selling machine.
Feature●Creating reflow profile conditions has never been easier.
●Built-in PC function allows operation by itself.
●The local matrix control system of upper heater makes possible for reflow soldering less than 5C.>
●Low power consumption provides excellent cost-performance benefits.
|Applicable Circuit Board||
Up to 250W x 330L
Height: When the lower limit of the carrier bar is set: 5 mm below, 28 mm above, when the upper limit is set: 31 mm below, 2 mm above * Dimensions from the bottom of the board
|Heating Method||Upper-face : Extreme infrared radiation with hot air
Lower-face : Extreme infrared radiation (Option)
|Cooling Method||Exhaust damper continuous operation by flowing air or N2 air
(with flow adjustable valve)
|Power Supply||3-phase 200V 50/60Hz 8kVA （For optional lower-heater specifications：10.4kVA）|
|Air||0.3 - 0.5MPa 100 liter/min (Maximum)|
|O2 Concentration in Furnace
(when using N2)
|PCB Installation||Net system or Carrier system (Selectable on request)|
|Upper-Heater||Extreme infrared radiation with hot air heater : 7.2kW (Approx.240W x 30 block) * Adjustments can be made using the Matrix control system|
|Lower-Heater(Option)||Extreme infrared radiation heater : Approx. 2.4kW (400W x 6)|
|Temp. Accuracy||Room temp. - 80C : +/-3C 80C - 300C : +/-2C 300℃～400℃：±3℃|
|Measuring Temp. Range||Room temp. - 400C|
|Measuring Points||1 - 6 points( Automatic mode: 7points)|
|N2 Gas Supply Function||100 liter/min. with flow regulating valve during operation.|
Built-in personal computer with Control software
Profile creation / data analysis: RDT-250ECS (Supported OS: Windows10, separate external PC required)
- Option : OXYGEN ANALYZER
- Option : N2 FLOW MIXING METER
- * The above specifications are subject to change without notice.