MALCOM CO.,LTD. DIP WETTING TESTER SWB-2

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DIP WETTING TESTER

SWB-2

This machine is automatic wetting tester from Flux spreading to measurement by Wetting Balance method.

【Features】

●The entire procedure, from Flux application (w/ Flux Temperature Control Function) to Measurement End is automated. Reducing unstable measurement results, and user error.

●Complies with the Wetting test method according to JIS Z3198 (Lead Free Solder Test Method) standards.

●Easily change Solder and Flux when necessary.

●Electro-Balance Sensor detects a small force.

●Efficiently analyze data with the exclusive PC software. (option)

●An optional cover allows for wetting evaluation in a N₂ environment. (option)

●Micro Wetting Balance Measuring method is available.(option)

【Specifications】

Item		Specification
Load sensor	Principle	Electro-Balance Sensor (EBS)
	Measuring Range	30mN - -30mN
	Accuracy	+/-0.05mN
	Resolution	0.01mN
Temp. Sensor	Measuring Range	0 - 450C
	Accuracy	+/-3C
Insertion Time		1 - 200s
Insertion Depth		0.01 - 20.00mm (0.01mm step)
Insertion Speed		0.1 - 30mm/s
Solder Temp. Setting		Room Temp. - 400C (Micro-wetting : Room Temp. - 320C)
Japanese Standard		Automatic Measurement (Flux Application, Removal and Measurement) JIS Z3198-4 and C60068-2-54 ,C60068-2-54,C6008-2-69 JEITA ET7411 (Solder Bath)
International Standard		ISO 9455-16 IEC 60068-2-54 and 60068-2-69 (Solder bath) ANSI J-STD-003, MIL STD-883 (Method 2022.2) and IPC TM-650 (2.4.14.2)
N₂ Measurement		Oxygen Concentration : 500ppm max. (optional)
Power Supply		AC100V
Outer Dimension		300W x 330D x 370H mm
Weight		Approx. 16kg

*The measurement accuracy of the load sensor excludes the error margin such as the vibrations or others.
*When high-speed infiltrating, the vibration of the table might influence the measurement result.

The above specifications are subject to change without notice.