SOLDER-PASTE PRINT INSPECTION SYSTEM(TD-4M)

Usage

Inspection system for measuring paste area and volume easily.

Feature

  • ●Minimum functions and high cost performance.
  • ●Measure the height of solder paste using slit laser. * A Colored CCD camera makes it possible for clear
       image inspection.
  • ●Coordinates-Display-Function allows you to move PCB to the inspection position that you desire easily.
  • ●Save data in USB memory.
  • ●SPC data analysis of the automated measurement data. (optional)

product specification

Item Specification
Model Name TD-4M
PC Board clamp table Circuit board gripping allowance 3mm, both-side clamping is possible
Outer Dimension 420(W) x 635(D) x 350(H) mm
System High-speed image processing computer system built in
Weight 22kg
Power Supply AC100 - 240V, 50-60Hz, 140W (Service AC outlet not included)
Interface USB for printer
USB for flash memory
Keyboard Input
Mouse Input
Monitor Output

【Measurement Specifications】

Item Specification
Inspection Object Thickness of printed solder paste
PCB Warpage Range ±1.5mm
Measurement Range 2mm(W), 3mm(D), 50 - 350μm(H)
Resolution 8μm
dgment function Automatic OK/NG judgment
Standard Position Setting Taking in PCB display image (One point)
Speed 1 second or less / visual field (Standard)
Data Input method : Teaching, number of data : 150 fields
Output Output to printer and in text files
PCB Dimension Outside: 50 x 50mm min., 250 x 330mm max. Thickness: 0.5 - 2.0 mm
Measurable range 240×320mm
Optical Section Light Source 660nm semi-conductor laser
Camera 1/4-inch color CCD
Camera Field 4mm×3mm
Measuring Principle Optical cutting triangular surveying by laser slit light, irradiation angle 45deg.
Cut slit 20μm x 10mm
Safety Classification Classification acc. to laser danger level: Class 2
  • * The above specifications are subject to change without notice.